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IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
Product Details
- Edition:
- 1.0
- Published:
- 08/29/2016
- Number of Pages:
- 45
- File Size:
- 1 file , 1000 KB