IPC J-STD-001F-WAM1

Requirements for Soldered Electrical and Electronic Assemblies with Amendment 1
standard by Association Connecting Electronics Industries, 04/01/2016

IPC D-351

Printed Board Drawings in Digital Form
standard by Association Connecting Electronics Industries, 08/01/1985

IPC 2251

Design Guide for the Packaging of High Speed Electronic Circuits
Handbook / Manual / Guide by Association Connecting Electronics Industries, 11/01/2003

IPC 4203

Adhesive Coated Dielectric Films for Use as Cover Sheets for Flexible Printed Circuitry and Flexible Adhesive Bonding Films
standard by Association Connecting Electronics Industries, 05/01/2002

IPC 6018C

Qualification and Performance Specification for High Frequency (Microwave) Printed Boards
standard by Association Connecting Electronics Industries, 07/01/2016

IPC 6013D

Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2017

IPC J-STD-003C-WAM1

Solderability Tests for Printed Boards with Amendment 1
standard by Association Connecting Electronics Industries, 05/01/2014

IPC J-STD-028

Performance Standard fo Construction of Flip Chip and Chip Scale Bumps
standard by Association Connecting Electronics Industries, 04/01/1999

IPC D-390A

Automated Design Guidelines
standard by Association Connecting Electronics Industries, 02/01/1988

IPC 9121

Troubleshooting for Printed Board Fabrication Processes
standard by Association Connecting Electronics Industries, 02/01/2016