User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
standard by Association Connecting Electronics Industries,
Category: IPC
IPC HDBK-830A
Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013
IPC 2152-DE
Standard for Determining Current Carrying Capacity in Printed Board Design (Designrichtlinie für die Bestimmung der Stromtragfähigkeit von Leiterplatten)
standard by Association Connecting Electronics Industries, 05/01/2010
IPC 9706
Mechanical Shock In-situ Electrical Metrology Test Guidelines for FCBGA SMT Component Solder Crack and Pad Crater/Trace Crack Detection
standard by Association Connecting Electronics Industries, 12/01/2013
IPC 4556
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
standard by Association Connecting Electronics Industries, 01/01/2013
IPC C-406
Design and Application Guidelines for Surface Mount Connectors
standard by Association Connecting Electronics Industries, 01/01/1990
IPC 1791
Trusted Electronic Designer, Fabricator and Assembler Requirements
standard by Association Connecting Electronics Industries, 08/01/2018
IPC QE-605A
Printed Board Quality Evaluation Handbook
standard by Association Connecting Electronics Industries, 02/01/1999
IPC 4101C
Specification for Base Materials for Rigid and Multilayer Printed Boards
standard by Association Connecting Electronics Industries, 08/01/2009
IPC HDBK-830
Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 10/01/2002