Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001
Category: IPC
IPC A-610C
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2000
IPC EMBPAS03
IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" – Northbrook, IL – June 2003
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003
IPC 9691B
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016
IPC HDBK-850
Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012
IPC DW-424
General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995
IPC 9631
User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010
IPC 9592A
Requirements for Power Conversion Devices for the Computer and Telecommunications Industries
standard by Association Connecting Electronics Industries, 05/01/2010
IPC 2152
Standard for Determining Current Carrying Capacity in Printed Board Design
standard by Association Connecting Electronics Industries, 08/01/2009
IPC 1602
Standard for Printed Board Handling and Storage
standard by Association Connecting Electronics Industries, 04/07/2020