Category: IPC

Technical Proceedings for the Designers Learning Symposium – 2001
Conference Proceeding by Association Connecting Electronics Industries, 07/18/2001

Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 01/01/2000

Standard for Printed Board Handling and Storage
standard by Association Connecting Electronics Industries, 04/07/2020

Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies
standard by Association Connecting Electronics Industries, 07/01/2017

Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards with Amendments 1 and 2
standard by Association Connecting Electronics Industries, 12/01/2012

IPC International Conference on Embedded Passives "The Faster and Cleaner Electronic Signals for the Future" – Northbrook, IL – June 2003
Conference Proceeding by Association Connecting Electronics Industries, 07/01/2003

User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance and Other Internal Electrochemical Migration Testing
standard by Association Connecting Electronics Industries, 06/01/2016

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
standard by Association Connecting Electronics Industries, 07/01/2012

General Specification for Encapsulated Discrete Wire Interconnection Boards
standard by Association Connecting Electronics Industries, 01/01/1995

User Guide for IPC-TM-650, Method 2.6.27, Thermal Stress, Convection Reflow Assembly Simulation
standard by Association Connecting Electronics Industries, 12/01/2010