Category: IPC

Design and Assembly Process Implementation for Flip Chip and Die-Size Components
standard by Association Connecting Electronics Industries, 01/01/2018

Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards
standard by Association Connecting Electronics Industries, 09/01/2016

National Conference on Bare Board and Advanced Substrate Electrical Test: HDI's Holy Grail Proceedings
Conference Proceeding by Association Connecting Electronics Industries, 01/01/1999

Statistical Process Control (SPC) Quality Rating
standard by Association Connecting Electronics Industries, 09/01/2002

Solderability Evaluation of Printed Boards with Protective Coatings Over Long Term Storage
standard by Association Connecting Electronics Industries, 10/01/1987

Acceptability of Printed Boards
standard by Association Connecting Electronics Industries, 07/09/2020

Printed Board Description in Digital Form
standard by Association Connecting Electronics Industries, 07/01/1992

Qualification and Performance Specification for Flexible Printed Boards, Includes Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2005

Telecom Addendum to IPC-A-610 Revision F Acceptability of Electronic Assemblies
Amendment by Association Connecting Electronics Industries, 01/01/2017

Metal Foil for Printed Board Applications with Amendment 1
standard by Association Connecting Electronics Industries, 01/01/2016