Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992

IEC ICC JEDEC ISPE MMPDS EEMUA
Guidelines for Multichip Module Technology Utilization
standard by Association Connecting Electronics Industries, 08/01/1992
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
standard by Association Connecting Electronics Industries, 11/01/1992
2010 California Fire Code, Title 24 Part 9
standard by International Code Council, 2010
2015 International Residential Code and Commentary Vol. 2 (Chapters 12-44)
Interpretation / Commentary by International Code Council, 08/01/2015
American National Standard for Electricity Metering Data Exchange – The DLMS/COSEM Suite Part 6-1: Object Identification System (OBIS)
standard by American National Standards Institute, 2019
Guidelines for older persons and persons with disabilities — Information and communications equipment, software and services — Part 7: Accessibility settings (Foreign Standard)
standard by Japanese Industrial Standard / Japanese Standards Association, 01/01/2011
User Guide for the IPC-TM-650, Method 2.6.25, Conductive Anodic Filament (CAF) Resistance Test (Electrochemical Migration Testing)
standard by Association Connecting Electronics Industries,
Multipurpose 1 Sided Test Pattern – Gerber Format
standard by Association Connecting Electronics Industries,
Guidelines for Design, Selection and Application of Conformal Coatings
Handbook / Manual / Guide by Association Connecting Electronics Industries, 08/01/2013
Accelerated Aging for Solderability Evaluations
standard by Association Connecting Electronics Industries, 12/01/1987