Terms & Definitions, Test Methods, and Design Examples for Buld-Up/High Density Interconnect (HDI) Printed Wiring Boards
standard by Association Connecting Electronics Industries, 01/01/2000
IPC 9201
Surface Insulation Resistance Handbook
standard by Association Connecting Electronics Industries, 04/01/1990
IPC A-610F
Acceptability of Electronic Assemblies
standard by Association Connecting Electronics Industries, 07/01/2014
IPC SM-784
Guidelines for Chip-on-Board Technology Implementation
standard by Association Connecting Electronics Industries, 11/01/1990
ICC IBC-2015 Commentary Volume 1
2015 International Building Code and Commentary Vol, 1 (Chapters 1-15)
Interpretation / Commentary by International Code Council, 03/01/2015
HEI Standards Discount Bundle 2
standard by Heat Exchange Institute, 2018
ANSI/NEMA MG 1-2003
Motors and Generators
standard by American National Standards Institute / National Electrical Manufacturers Association, 08/21/2003
JEDEC JESD220E
Universal Flash Storage (UFS)
standard by JEDEC Solid State Technology Association, 01/01/2020
AASHTO M 85-06
Standard Specification for Portland Cement
standard by American Association of State and Highway Transportation Officials,
AASHTO T 180-01 (2004)
Standard Method of Test for Moisture-Density Relations of Soils Using a 4.54-kg (10-lb) Rammer and a 457-mm (18-in.) Drop
standard by American Association of State and Highway Transportation Officials,