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Gives recommendations applying to integrated circuits supplied in packages using tape automated bonding (TAB) as the principal component for structural and interconnection functions. Covers the requirements for tape with bonded integrated circuits (IC) as supplied by a manufacturer to a user.
Product Details
- Edition:
- 2.0
- Published:
- 04/23/1997
- Number of Pages:
- 71
- File Size:
- 1 file , 570 KB